APG on-site manufacturing includes:

  • Thick film substrate

  • Chips and Die attach

  •  Wire bonding

  •  Hermetic packaging

 

APG performs production of the hybrid modules in a 3.000 sq. meters manufacturing site, housing a 300 sq. meters ISO 7 clean room: deionised water distribution, compressed air distributionm nitrogen distribution, technical vacuum. 


 

Screening and LAT equimpment (according ECSS-Q-ST-60-05C):

  • Bombing station

  • Helium leak detector

  • Gross leak detector

  • Burn in station

  • PIND tester

  • Thermal cycling and shock chamber

  • Autopatic acceptance testing

 

 

Certifications:

  • ECSS-Q-ST-70-38

  • ECSS-Q-ST-70-08

  • UNI EN 9100:2018

  • ISO 9001:2015

 

 

 


  

 

 

 

 

 APG on-site manufacturing includes:

  • Thick film substrate

  • Chips and Die attach

  •  Wire bonding

  •  Hermetic packaging

APG performs production of the hybrid modules in a 3.000 sq. meters manufacturing site, housing a 300 sq. meters ISO 7 clean room: deionised water distribution, compressed air distributionm nitrogen distribution, technical vacuum. 


Screening and LAT equimpment (according ECSS-Q-ST-60-05C):

  • Bombing station

  • Helium leak detector

  • Gross leak detector

  • Burn in station

  • PIND tester

  • Thermal cycling and shock chamber

  • Autopatic acceptance testing

Certifications:

  • ECSS-Q-ST-70-38

  • ECSS-Q-ST-70-08

  • UNI EN 9100:2018

  • ISO 9001:2015